All PROJECT

  1. PROJECT
one two four
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    FPC drilling phi100um cover.jpg

    FPC Drilling

    NTSTechnologycanprovidehigh-speed,high-qualitysoftboarddrillingtechnology.
    FPC Drilling
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    FPC Cutting

    Fastlasersoftcuttingprocessing,highprecision,lowcarbonblack.
    FPC Cutting
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    PCB Cutting

    Uselasertocutallkindsofcircuitboards,highspeed,highquality,highflexibility,lowcost.
    PCB Cutting
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    PI cutting.jpg

    PI cutting

    Highspeed,highquality,lowcarbonblackPIfilmdrilling.  
    PI cutting
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    PI鑽孔 _2_.jpg

    PI drill

    Highspeed,highquality,lowcarbonblackPIfilmdrilling.
    PI drill
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    TCO patterning_invisible_1.jpg

    Transparent conductive film

    Etchingtransparentconductivefilmthroughlaserlight.
    Transparent conductive film
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    陶瓷加工.jpg

    Ceramics drill

    NTSTechnologydevelopsvariousceramicdrillingandgroovingprocessingforcustomerapplications.
    Ceramics drill
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    LTCC drill

    NTSTechnologyaimsatthedrillingofunsinteredceramics,thesizecanreach20um,andtheprocessingspeedalsomeetscustomerrequirements.
    LTCC drill
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    玻璃切割_剖_.jpg

    Glass Cut

    Throughlasermodificationtechnology,thequalityofglasscuttingcanbegreatlyimproved.Thesectionissmooth,andthecuttingchippingcanreachbelow30um.
    Glass Cut
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    Si wafer marking.jpg

    Marking Si Wafer

    NTSTechnology  haspreciselasercontrol,whichcanrealizemarkingapplicationswithacharacterheightoflessthan50um.
    Marking Si Wafer
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    封測應用.jpg

    package test

    AfterEpoxypackagethechip,canusealasertoopentheholeontheEpoxypackagematerialandexposethebottomCu,thenfilltheholewithCu.
    package test
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    CIGS patterning.jpg

    solar patterning

    Uselasertomakespecificpatternsonsolarpanel.
    solar patterning