Semiconductor
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Marking Si Wafer
NTSTechnology haspreciselasercontrol,whichcanrealizemarkingapplicationswithacharacterheightoflessthan50um. -
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package test
AfterEpoxypackagethechip,canusealasertoopentheholeontheEpoxypackagematerialandexposethebottomCu,thenfilltheholewithCu.